| # | Source | Title | Summary | Topics | Link |
|---|---|---|---|---|---|
| 1 | SemiEng | Vertical DRAM Stacking Expands Thermal Design Space Beyond HBM-on-GPU (imec) | Researchers at imec published “Beyond HBM-on-GPU: Thermal Design Envelope for 3D Volumetric DRAM-on-GPU Integration.” Summary: Researchers evaluated a 3D memory architecture that rotates DRAM dies vertically above a GPU and places cooling cavities between them as an alternative to conventional 2.5D HBM and direct-stack | Semiconductor | Read |
| 2 | TechAsia | NUHS, SingHealth join Cambridge-led AI blood test project | The BloodCounts! consortium won a 2021 Trinity Challenge prize for infectious-disease detection. | AI | Read |
| 3 | DigiTimes | Podcast highlights: TSMC's 3nm demand story, Samsung HBM shift, and A14 ramp | Following TSMC's third-quarter 2026 earnings call, DIGITIMES analyst Luke Lin provided in a podcast additional analysis of several details that received limited attention in market coverage, including a new 3nm fab at the Southern Taiwan Science Park (STSP), the transfer of Nvidia-related high-bandwidth memory (HBM) ba | Semiconductor | Read |
| 4 | DigiTimes | India roundup: India's tech build-out opens new markets, but foreign suppliers are first in line | India's tech push opens markets unevenly: foreign suppliers get first crack at Tata's fab, Lam courts local vendors, Jio's IPO tests its 5G pitch, and CleanMax powers AI data centers. | AISemiconductor | Read |
| 5 | NikkeiAsia | For India's IT giants TCS and Infosys, AI both dents and supports growth | For India's IT giants TCS and Infosys, AI both dents and supports growth | AI | Read |
⭐ Today's Top Story
Vertical DRAM Stacking Expands Thermal Design Space Beyond HBM-on-GPU (imec)
Researchers at imec published “Beyond HBM-on-GPU: Thermal Design Envelope for 3D Volumetric DRAM-on-GPU Integration.” Summary: Researchers evaluated a 3D memory architecture that rotates DRAM dies vertically above a GPU and places cooling cavities between them as an alternative to conventional 2.5D HBM and direct-stack
Asia Tech News Digest - October 26, 2026
Generated: 2026-10-26 08:00 UTC · Sources: 4 websites monitored