Asia Tech News Digest - September 08, 2026

3
Semiconductor
0
Electronics
0
Logistics
0
Pharmaceutical
0
Biotechnology
4
AI
0
Automation
0
Machine Vision
# Source Title Summary Topics Link
1 TechAsia US tech firms eye Australia for AI data centers None of the 9 gigawatts of proposed data-center capacity had been commissioned by June. AI
2 DigiTimes SK Hynix weighs Gwangju investment as Yongin buildout continues SK Hynix is considering accelerating investment in South Korea's planned Gwangju semiconductor cluster so that development proceeds alongside its ongoing Yongin buildout, rather than waiting for Yongin to advance further, according to Dealsite , citing industry sources. The potential overlap is raising a key question f Semiconductor
3 DigiTimes SST market grows 32% as global players race to secure position As AI server computing power and per-rack power density continue to rise, traditional 54VDC power architectures are hitting bottlenecks such as excessive current, higher copper usage, and greater transmission losses. This is pushing next-generation AI data center power designs toward 800V high-voltage direct current (H AI
4 DigiTimes TSMC's Germany fab draws Leipzig University rector to Taiwan TSMC's investment in a fab in Germany's Free State of Saxony has drawn close attention from across Europe. Eva Ins Obergfell, Rector of Leipzig University, one of Germany's leading universities, recently visited Taiwan and toured National Taiwan University and National Tsing Hua University, among others, to explore ide Semiconductor
5 CNA Commentary: Why America’s debt binge is starting to matter If long-term interest rates decisively breach the 5 per cent threshold, the impact could derail the AI boom, says Ruchir Sharma for the Financial Times. AI
6 TechAsia HSA registers healthtech firm Oral Link’s AI dental tool Oral Link, a Singapore-based dental AI startup, said the product is Singapore’s first HSA-registered AI dental screening tool for direct consumer use. AI
7 NikkeiAsia Huawei unveils first triple-fold phone with 'US-free' core chips Huawei unveils first triple-fold phone with 'US-free' core chips Semiconductor

Generated: 2026-09-08 00:09 UTC · Sources: 4 websites monitored