| # | Source | Title | Summary | Topics | Link |
|---|---|---|---|---|---|
| 1 | DigiTimes | Micron reportedly targets 2× HBM capacity by end-2026; Samsung, SK Hynix keep the scale edge | Micron is reportedly preparing to roughly double its high-bandwidth memory capacity by the end of 2026, targeting about 100,000 wafers a month while sharply increasing 12-high HBM4 output for Nvidia's Vera Rubin AI platform. | AISemiconductor | Read |
| 2 | DigiTimes | CPO high-density optical interconnects drive E&R's submicron 2D FAU breakthrough | To meet next-generation high-speed optical interconnect demand, fiber array units (FAU) are moving from traditional one-dimensional layouts to high-density two-dimensional (2D) architectures, raising the bar for hole positioning accuracy, micro-hole size, packing density, and process stability. At SEMICON Taiwan 2026, | Semiconductor | Read |
| 3 | DigiTimes | Taiwan to expand AI compute capacity as supercomputer at research institute hits full load | Taiwan is racing to expand its AI compute capacity as demand for AI chips, GPUs and AI servers surges, with compute infrastructure now central to national competitiveness. According to data provided by the National Science and Technology Council (NSTC), the government-backed mainframe Nano 5 is already fully loaded, wh | AISemiconductor | Read |
| 4 | EETAsia | Enterprise SSD Revenue Doubles to Over $37B in 2Q 2026 as AI Demand Lifts Prices, Shipments | AI infrastructure expansion and higher NAND contract prices drove enterprise SSD revenue sharply higher in the second quarter. The post Enterprise SSD Revenue Doubles to Over $37B in 2Q 2026 as AI Demand Lifts Prices, Shipments appeared first on EE Times Asia . | AI | Read |
| 5 | EETAsia | Baya Systems Taps Singapore-based AdoreSys to Expand APAC Reach | Baya Systems and AdoreSys combine fabric IP, architecture exploration, and ASIC expertise to address complex data-movement challenges. The post Baya Systems Taps Singapore-based AdoreSys to Expand APAC Reach appeared first on EE Times Asia . | Semiconductor | Read |
| 6 | EETAsia | Marvell Expands Memory Disaggregation Strategy to Ease AI Infrastructure Bottlenecks | Marvell's CXL, SSD and optical interconnect portfolio targets memory bottlenecks limiting scalability, efficiency and AI inference performance. The post Marvell Expands Memory Disaggregation Strategy to Ease AI Infrastructure Bottlenecks appeared first on EE Times Asia . | AI | Read |
| 7 | TechAsia | Saudi AI firm Humain unveils Arabic model built on MiniMax M3 | The launch comes as Saudi Arabia seeks more control over AI technology. | AI | Read |
| 8 | TechAsia | ServiceNow buys Israeli AI startup Sweep | The deal would support ServiceNow’s push into AI agents and autonomous enterprise work. | AI | Read |
| 9 | TechAsia | AMD, Delhi University to train 10,000 in AI tech | The program will give students and faculty access to AMD’s ROCm open-source AI software platform, technical workshops, learning materials. | AI | Read |
| 10 | NikkeiAsia | Nobody likes data centers and chips, chips, chips | Nobody likes data centers and chips, chips, chips | Semiconductor | Read |
⭐ Today's Top Story
Micron reportedly targets 2× HBM capacity by end-2026; Samsung, SK Hynix keep the scale edge
Micron is reportedly preparing to roughly double its high-bandwidth memory capacity by the end of 2026, targeting about 100,000 wafers a month while sharply increasing 12-high HBM4 output for Nvidia's Vera Rubin AI platform.
Asia Tech News Digest - September 04, 2026
Generated: 2026-09-04 04:09 UTC · Sources: 4 websites monitored