Asia Tech News Digest - September 03, 2026

5
Semiconductor
0
Electronics
0
Logistics
0
Pharmaceutical
0
Biotechnology
10
AI
1
Automation
0
Machine Vision
# Source Title Summary Topics Link
1 TechAsia Meta releases Muse Spark 1.3 with coding upgrades The release comes as Meta increases spending on AI infrastructure and hiring to strengthen its position against OpenAI and Anthropic. AI
2 DigiTimes CPO material race widens as Taiwan eyes key role At the Semicon Network Summit 2026, speakers from Marvell, the Netherlands Organisation for Applied Scientific Research's Holst Centre, the UK Semiconductor Centre, and the Taiwan Semiconductor Industry Association (TSIA) discussed the future of silicon photonics (SiPh). They said the industry's bottlenecks have shifte Semiconductor
3 DigiTimes Auras sees ASIC revenue reaching 50% in 2027, eyes microchannel cooling production in 2028 Cooling specialist Auras Technology is expanding from GPU platforms to ASIC-related products as its next growth driver, amid the ongoing shift toward liquid cooling in AI servers, with chairman Steve Lin highlighting sustained progress in projects for major international cloud service providers (CSP) such as AWS and Me AI
4 DigiTimes JPC Connectivity sees AI demand driving orders into 2027 as margins benefit from longer lead times JPC Connectivity said demand tied to artificial intelligence infrastructure continued to strengthen in the second quarter of 2026, lifting orders for optical communications, high-speed transmission, and high-power products. The connector and cable maker said visibility now stretched into 2027, and in some cases into 20 AI
5 CNA Uber and AI-firm Wayve launch London's first robotaxis Uber and AI-firm Wayve launch London's first robotaxis Automation
6 EETAsia How AI-Powered Sensor Fusion Improves Drone Navigation and Detection Drones and counter-drone systems rarely rely on one sensor. By fusing radar, optical, LiDAR, and inertial data with real-time AI algorithms, sensor fusion turns partial signals into one reliable picture—improving navigation, obstacle avoidance, target tracking, and threat classification in GPS-denied or visually clutte AI
7 EETAsia How AI Infrastructure Spans Multiple Semiconductor Process Nodes AI infrastructure increasingly depends on multiple fabs and semiconductor technologies converging through advanced packaging, power, memory, and connectivity. The post How AI Infrastructure Spans Multiple Semiconductor Process Nodes appeared first on EE Times Asia . SemiconductorAI
8 TechAsia US AI startup Cognition in talks to raise $1b at $47b valuation Investors have indicated nearly US$10 billion of interest in the round. AI
9 TechAsia Dell shares jump 10% after raising revenue outlook Dell’s AI server backlog reached US$95 billion at the end of its fiscal second quarter. AI
10 EETAsia Microchip Shrinks PolarFire Ethernet Sensor Bridge for Edge AI Systems Microchip's second-generation sensor bridge cuts board size while expanding camera support and Ethernet connectivity for edge AI applications. The post Microchip Shrinks PolarFire Ethernet Sensor Bridge for Edge AI Systems appeared first on EE Times Asia . AISemiconductor
11 NikkeiAsia 'Cyborg' rescue roaches take another leap forward with AI 'Cyborg' rescue roaches take another leap forward with AI AI
12 NikkeiAsia Marubeni should focus on long-term needs, not chase chip trends: CEO Marubeni should focus on long-term needs, not chase chip trends: CEO Semiconductor
13 NikkeiAsia More memory chips not the solution to AI bottlenecks: Microsoft exec More memory chips not the solution to AI bottlenecks: Microsoft exec AISemiconductor

Generated: 2026-09-03 00:02 UTC · Sources: 5 websites monitored