Asia Tech News Digest - August 19, 2026

4
Semiconductor
1
Electronics
2
Logistics
0
Pharmaceutical
0
Biotechnology
4
AI
1
Automation
0
Machine Vision
# Source Title Summary Topics Link
1 TechAsia Scaling indigenous defense robotics for emerging markets Backed by more than US$400,000, Dubotech develops portable underwater robots for a US$6.4 billion inspection market. Automation
2 TechAsia Alibaba-backed AI video startup ShengShu eyes HK IPO Vidu offers text-to-video generation through subscriptions and an API for businesses and developers. AI
3 DigiTimes Vietnam eyes city upgrades for Samsung hub Bac Ninh and Quang Ninh Vietnam is considering plans to turn Bac Ninh, a major Samsung Electronics manufacturing hub, and Quang Ninh into centrally administered cities as the country builds out its northern electronics, semiconductor and logistics base. SemiconductorElectronicsLogistics
4 TechAsia A16z joins $700m round for US AI chip startup Etched Its Sohu chip is designed specifically for transformer-model inference. AISemiconductor
5 DigiTimes Taiwan seeks shift from drone supplier to strategic partner in entering US market Industry figures and analysts from Taiwan and the United States gathered on August 19 at an international unmanned aerial vehicles (UAVs) forum to discuss how Taiwan can move beyond its traditional role as a components supplier and become a strategic partner in the global drone supply chain. The discussion takes place Logistics
6 DigiTimes GigaDevice profit surges 1,092% on memory upcycle, niche DRAM and NAND gains GigaDevice Semiconductor posted record first-half 2026 results, with tight memory supply and rising prices across niche products lifting earnings well beyond its full-year 2025 level. Semiconductor
7 EETAsia TIER IV Develops Open-Source AI Chip Architecture for Level 4 Autonomous Driving TIER IV is developing an open-source AI chip and toolchain targeting efficient, adaptable, and verifiable Level 4 autonomous driving. The post TIER IV Develops Open-Source AI Chip Architecture for Level 4 Autonomous Driving appeared first on EE Times Asia . AISemiconductor
8 EETAsia Manz Asia Expands Panel-Level Packaging Platforms for Advanced RDL Manz Asia expands production-proven panel platforms as AI packaging drives larger formats and denser redistribution layers. The post Manz Asia Expands Panel-Level Packaging Platforms for Advanced RDL appeared first on EE Times Asia . AI

Generated: 2026-08-19 08:00 UTC · Sources: 3 websites monitored